Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics

Sang Il Kim, Kyu Hyoung Lee, Hyeon A Mun, Hyun Sik Kim, Sung Woo Hwang, Jong Wook Roh, Dae Jin Yang, Weon Ho Shin, Xiang Shu Li, Young Hee Lee, G. Jeffrey Snyder, Sung Wng Kim

2015Published
2.1KCitations
0References
journal articleType

Abstract

Squeezing out efficient thermoelectrics Thermoelectric materials hold the promise of converting waste heat into electricity. The challenge is to develop high-efficiency materials that are not too expensive. Kim et al. suggest a pathway for developing inexpensive thermoelectrics. They show a dramatic improvement of efficiency in bismuth telluride samples by quickly squeezing out excess liquid during compaction. This method introduces grain boundary dislocations in a way that avoids degrading electrical conductivity, which makes a better thermoelectric material. With the potential for scale-up and application to cheaper materials, this discovery presents an attractive path forward for thermoelectrics. Science , this issue p. 109

Journal: Science

Publisher: American Association for the Advancement of Science (AAAS)

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